Challenges and Advances in Electrical Interconnect Analysis
نویسندگان
چکیده
A growing need exists for electrical interconnect analysis ( E I A ) fo r chips, packages and printed circuit boards. I n this short tutorial we review key issues regarding EIA for V L S I parasitic circuits. W e give a general introduction of important aspects for technologies with different performances and then we review some issues of concern fo r state of the art high performance chips and pack-
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